Q a efi atesɛm krataa yi mu (Reporter Lin Xiao) Ɛnnɛ, awo ntoatoaso a ɛto so abiɛsa artificial inbere saligence chip "Lingxin" a School of Integrated Circuits of Tsinghua University ne Huaxin mfiridwuma abom ayɛ no wɔ aban kwan so. Sɔhwɛ data kyerɛ sɛ chip’s energy efficiency ratio du trillion operations per watt (tops/w) wɔ general artificial inbere saligence computing nnwuma mu, a ɛboro mprempren chips titiriw a ɛwɔ amanaman ntam gua so no so bɛyɛ 50% na ɛde kyerɛwtohɔ foforo si hɔ wɔ nnwuma no mu.

“"Lingxin" chip no fa storage ne computing architecture a wɔaka abom foforo ne 5-nanometer nhyehyɛe, a ɛtew data a wɔde mena no so kɛse ne tumi a wɔde di dwuma no so. Ɔbenfo Li Feng, R&D kuw no panyin kae sɛ: “Ɛnyɛ sɛ saa nkɔso yi kyerɛ sɛ wɔde nyansa a wɔde ayɛ nneɛma a ɛyɛ adwuma yiye na ɛnyɛ nea atwa yɛn ho ahyia ho nhyehyɛe ma nko, na mmom ɛma mmoa titiriw ma bere ankasa mu nyansa a wɔde yɛ edge mfiri ahorow (te sɛ kar a ɛyɛ adwuma a ɛyɛ nea ɛpɛ ne nneɛma a wɔde di dwuma wɔ Intanɛt so) a ɛyɛ den. ”

Ɛfata sɛ yɛhyɛ no nsow sɛ "lingxin" wɔ ahobammɔ isolation module a wɔasisi wɔ design stage no mu, a ebetumi asiw hardware-level data leaks ne adwemmɔne ntua ano yiye. Wang Ying, Huaxin Technology CEO, daa no adi sɛ chip no adu we cooperation adwene ho wɔ ɔman no mu smart manufacturing ne New Energy Vehicle nnwumakuw dodow bi ho, na wɔhwɛ kwan sɛ nnwinnade kuw a edi kan no bɛba wɔ afe a edi hɔ no fã a edi kan no mu.

Nnwuma mu abenfo gye di sɛ "lingxin" a aba no kyerɛ sɛ me man no ahyɛ ase foforo a ɛfa nneɛma foforo a ɛde ne ho ne nkɔso a edi kan wɔ artificial inbere saligence basic hardware mu, a ɛde nkannyan a emu yɛ den aba wiase nyinaa nyansa a wɔde ayɛ adwuma no nkɔso a ɛbɛkɔ so atra hɔ daa no mu.